We use cookies to make your experience better.
To comply with the new e-Privacy directive, you agree to the privacy policy and our use of cookies.
Cooler Master HYPER 612 Ver. 2 Processor 12 cm Black
SKU
RR-H6V2-13PK-R1
Category: PC Cooling
SKU | RR-H6V2-13PK-R1 |
---|---|
EAN | 0884102026799 |
Manufacturer | Cooler Master |
Availability | Out of Stock |
Product Manuals (HTML) |
View Manual |
The Cooler Master Hyper 612 Ver.2 provides excellent CPU cooling performance. It features a large fin structure that accelerates heat dissipation by maximizing surface area. Hyper 612 Ver.2's intelligent 120mm PWM fan ensures a low noise solution. Six direct contact heatpipes and folding fin structure effectively guides air and provides an accelerated cooling system.
The Cooler Master Hyper 612 Ver.2 provides excellent CPU cooling performance. It features a large fin structure that accelerates heat dissipation by maximizing surface area. Hyper 612 Ver.2's intelligent 120mm PWM fan ensures a low noise solution. Six direct contact heatpipes and folding fin structure effectively guides air and provides an accelerated cooling system.
DIRECT THERMAL TRANSFER
Six (6) Direct Contact Heatpipes for accelerated surface to surface thermal transfer.
EXCELLENT HEAT DISTRIBUTION
Folding Fin Structure for the best air guiding, increased efficiency and heat dissipation
X-VENT TECHNOLOGY
Air-Guide design places 45 degree angled vents around each Direct Contact Heatpipe for better cooling.
EASY INSTALLATION
Easy-to-use, universal mounting system for all common Intel and AMD platforms.
MEASUREMENT DIAGRAM
Hyper 612 V2 optimized profile for greater mid tower compatibility and memory clearance.
COVERAGE
Parts, product replacement, and free technical support.
The Cooler Master Hyper 612 Ver.2 provides excellent CPU cooling performance. It features a large fin structure that accelerates heat dissipation by maximizing surface area. Hyper 612 Ver.2's intelligent 120mm PWM fan ensures a low noise solution. Six direct contact heatpipes and folding fin structure effectively guides air and provides an accelerated cooling system.
DIRECT THERMAL TRANSFER
Six (6) Direct Contact Heatpipes for accelerated surface to surface thermal transfer.
EXCELLENT HEAT DISTRIBUTION
Folding Fin Structure for the best air guiding, increased efficiency and heat dissipation
X-VENT TECHNOLOGY
Air-Guide design places 45 degree angled vents around each Direct Contact Heatpipe for better cooling.
EASY INSTALLATION
Easy-to-use, universal mounting system for all common Intel and AMD platforms.
MEASUREMENT DIAGRAM
Hyper 612 V2 optimized profile for greater mid tower compatibility and memory clearance.
COVERAGE
Parts, product replacement, and free technical support.
Performance | |
---|---|
Suitable location | Processor |
Rotational speed (min) | 800 RPM |
Rotational speed (max) | 1300 RPM |
Noise level (low speed) | 11 dB |
Noise level (high speed) | 20 dB |
Number of heat pipes | 6 |
Type | Cooler |
Fan diameter | 12 cm |
Supported processor sockets | Socket AM2, Socket AM2+, Socket AM3, Socket AM3+, Socket FM1, Socket FM2, Socket FM2+, LGA 1151 (Socket H4), LGA 2011-v3 (Socket R) |
Minimum airflow (imperial) | 26.6 cfm |
Maximum airflow | 44.2 cfm |
Minimum air pressure | 0.6 mmH2O |
Maximum air pressure | 1.6 mmH2O |
Mean time between failures (MTBF) | 40000 h |
Design | |
Number of heat pipes | 6 |
Product colour | Black |
Technical details | |
Noise level (low speed) | 11 dB |
Noise level (high speed) | 20 dB |
Number of heat pipes | 6 |
Type | Cooler |
Fan diameter | 12 cm |
Supported processor sockets | Socket AM2, Socket AM2+, Socket AM3, Socket AM3+, Socket FM1, Socket FM2, Socket FM2+, LGA 1151 (Socket H4), LGA 2011-v3 (Socket R) |
Minimum airflow (imperial) | 26.6 cfm |
Maximum airflow | 44.2 cfm |
Minimum air pressure | 0.6 mmH2O |
Maximum air pressure | 1.6 mmH2O |
Product life | 40000 h |
Power | |
Voltage | 12 V |
Power consumption (typical) | 1.08 W |
Maximum current | 0.09 A |
Colour | |
---|---|
Product colour | Black |
Weight & dimensions | |
Fan dimensions (W x D x H) | 120 x 120 x 25 mm |
Package depth | 208 mm |
Package width | 192 mm |
Package height | 190 mm |
Heatsink weight | 732 g |
Width | 150 mm |
Package weight | 1.4 kg |
Depth | 129 mm |
Height | 160 mm |
Weight | 886 g |
Heatsink dimensions (W x D x H) | 139 x 102 x 160.4 mm |
Endurance | |
Mean time between failures (MTBF) | 40000 h |
Packaging data | |
Package depth | 208 mm |
Package width | 192 mm |
Package height | 190 mm |
Package weight | 1.4 kg |
Other features | |
Heatsink dimensions (W x D x H) | 139 x 102 x 160.4 mm |
Product life | 40000 h |