| Processor |
|---|
| Processor base frequency | 2.5 GHz |
| Cooler included | No |
| Processor codename | Skylake |
| Thermal Design Power (TDP) | 205 W |
| Processor cache | 38.5 MB |
| Processor model | 8180M |
| Processor threads | 56 |
| Processor operating modes | 64-bit |
| Processor boost frequency | 3.8 GHz |
| Stepping | H0 |
| Bus type | UPI |
| Component for | Server/workstation |
| Processor lithography | 14 nm |
| Processor family | Intel® Xeon® Platinum |
| Processor cores | 28 |
| Processor socket | LGA 3647 (Socket P) |
| Processor series | Intel Xeon Platinum 8000 Series |
| Processor cache type | L3 |
| Memory |
|---|
| Maximum internal memory supported by processor | 1460 GB |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 2666 MHz |
| Memory channels | Hexa-channel |
| ECC | Yes |
| Graphics |
|---|
| Discrete graphics card | No |
| On-board graphics card | No |
| Power |
|---|
| Thermal Design Power (TDP) | 205 W |
| Technical details |
|---|
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | S8S |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Embedded options available | No |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Thermal Design Power (TDP) | 205 W |
| Processor series | Intel Xeon Platinum 8000 Series |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Number of UPI links | 3 |
| Mode-based Execute Control (MBE) version | Yes |
| Intel® Volume Management Device (VMD) version | Yes |
| Intel® Run Sure Technology version | Yes |
| Integrated Intel® Omni-Path Architecture (Intel® OPA) version | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Features |
|---|
| Maximum number of PCI Express lanes | 48 |
| Thermal Design Power (TDP) | 205 W |
| Execute Disable Bit | Yes |
| PCI Express slots version | 3.0 |
| Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
| Scalability | S8S |
| Embedded options available | No |
| Market segment | Server |
| Processor special features |
|---|
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel 64 | Yes |
| Intel Turbo Boost Max Technology 3.0 | No |
| Intel® Speed Shift Technology | Yes |
| Intel® Optane™ Memory Ready | No |
| Intel TSX-NI | Yes |
| Intel® Turbo Boost Technology | 2.0 |
| Intel Trusted Execution Technology | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
| Intel® AES New Instructions (Intel® AES-NI) | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| AVX-512 Fused Multiply-Add (FMA) units | 2 |
| Intel® vPro™ Platform Eligibility | Yes |
| Operational conditions |
|---|
| Tcase | 84 °C |
| Other features |
|---|
| Compatibility | DL560 GEN10 |
