| Processor |
|---|
| Processor base frequency | 2.4 GHz |
| Memory bandwidth supported by processor (max) | 21 GB/s |
| Thermal Design Power (TDP) | 95 W |
| Processor cache | 8 MB |
| Processor model | X3430 |
| Processor threads | 4 |
| System bus rate | 2.5 GT/s |
| Processor operating modes | 64-bit |
| VID Voltage Range | 0.65 - 1.4 V |
| Processor boost frequency | 2.8 GHz |
| Stepping | B1 |
| Bus type | DMI |
| Component for | Server/workstation |
| Processor lithography | 45 nm |
| Processor family | Intel® Xeon® 3000 Sequence |
| Processor cores | 4 |
| Processor socket | LGA 1156 (Socket H) |
| Processor cache type | L3 |
| Memory |
|---|
| Memory types supported by processor | DDR3-SDRAM |
| Memory clock speeds supported by processor | 800,1066,1333 MHz |
| Memory bandwidth supported by processor (max) | 21 GB/s |
| Memory channels | Dual-channel |
| ECC | Yes |
| Graphics |
|---|
| On-board graphics card | No |
| Power |
|---|
| Thermal Design Power (TDP) | 95 W |
| VID Voltage Range | 0.65 - 1.4 V |
| Technical details |
|---|
| Thermal Monitoring Technologies | No |
| Intel® Turbo Boost Technology | Yes |
| Intel Trusted Execution Technology | Yes |
| Intel® Smart Cache | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Intel® AES New Instructions (Intel® AES-NI) | No |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| PCI Express slots version | 2.0 |
| PCI Express configurations | 1x16, 2x8, 4x4 |
| Number of Processing Die Transistors | 774 M |
| Processing Die size | 296 mm² |
| Supported instruction sets | SSE4.2 |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | Yes |
| Embedded options available | Yes |
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Thermal Design Power (TDP) | 95 W |
| Market segment | Server |
| Intel Virtualization Technology (VT-x) | Yes |
| Processor cache type | L3 |
| Features |
|---|
| Maximum number of PCI Express lanes | 1 |
| Thermal Design Power (TDP) | 95 W |
| Thermal Monitoring Technologies | No |
| Idle States | Yes |
| Execute Disable Bit | Yes |
| PCI Express slots version | 2.0 |
| PCI Express configurations | 1x16, 2x8, 4x4 |
| Number of Processing Die Transistors | 774 M |
| Processing Die size | 296 mm² |
| Supported instruction sets | SSE4.2 |
| Embedded options available | Yes |
| Market segment | Server |
| Processor special features |
|---|
| Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
| Intel® Turbo Boost Technology | Yes |
| Intel Trusted Execution Technology | Yes |
| Intel® Smart Cache | Yes |
| Intel® Hyper Threading Technology (Intel® HT Technology) | No |
| Intel® AES New Instructions (Intel® AES-NI) | No |
| Enhanced Intel SpeedStep Technology | Yes |
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
| Intel VT-x with Extended Page Tables (EPT) | Yes |
| Intel Demand Based Switching | Yes |
| Intel Virtualization Technology (VT-x) | Yes |
| Intel® vPro™ Platform Eligibility | No |
| Operational conditions |
|---|
| Tcase | 72.7 °C |
| Other features |
|---|
| Intel® Virtualization Technology (Intel® VT) | VT-d, VT-x |
