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Lenovo AMD EPYC 7702P processor 2 GHz 256 MB L3 Tray
SKU
02JG944
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Available for backorder
AMD EPYC 7702P, 2 / 3.35 GHz, 64C/128T, 256 MB L3 Cache, 200W TDP, Locked
Category: Processors
| SKU | 02JG944 |
|---|---|
| Manufacturer | Lenovo |
| Availability | Out of Stock |
| Processor | |
|---|---|
| Processor base frequency | 2 GHz |
| Processor manufacturer | AMD |
| Cooler included | No |
| Thermal Design Power (TDP) | 200 W |
| Processor cache | 256 MB |
| Processor model | 7702P |
| Processor threads | 128 |
| Processor operating modes | 32-bit |
| Processor boost frequency | 3.35 GHz |
| Component for | Server/workstation |
| Processor lithography | 7 nm |
| Processor family | AMD EPYC |
| Processor cores | 64 |
| Processor socket | Socket SP3 |
| Processor cache type | L3 |
| Package type | Tray |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Thermal Design Power (TDP) | 200 W |
| Technical details | |
|---|---|
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 200 W |
| Market segment | Server |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 200 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Harmonized System (HS) code | 85423119 |
| Packaging data | |
| Package type | Tray |
| Logistics data | |
| Harmonized System (HS) code | 85423119 |