Lenovo ThinkSmart Tiny Kit Intel® Core™ i3 i3-13100T 16 GB DDR4-SDRAM 256 GB SSD Windows 11 IoT Enterprise Mini PC Black

SKU
12XH0008UK
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Intel Core i3-13100T, 4C (4P + 0E)/8T, P-core 2.5/4.2GHz, 12MB, 2x 8GB SO-DIMM DDR4-3200, 256GB SSD M.2 2280 PCIe 4.0x4 NVMe Opal 2.0, Intel UHD Graphics 730, Intel Wi-Fi 6E AX211 802.11ax 2x2 + BT5.3, Windows 11 IoT Enterprise for Collaboration GAC 64
  • Intel Core i3-13100T, 4C (4P + 0E)/8T, P-core 2.5/4.2GHz, 12MB
  • 2x 8GB SO-DIMM DDR4-3200
  • 256GB SSD M.2 2280 PCIe 4.0x4 NVMe Opal 2.0
  • Intel UHD Graphics 730
  • Windows 11 IoT Enterprise for Collaboration GAC 64
More Information
SKU 12XH0008UK
EAN 0198155216312
Manufacturer Lenovo
Availability Out of Stock
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Gateway to Smarter Meetings Across Rooms

Gateway to Smarter Meetings Across Rooms

Certified for Microsoft Teams Rooms and powered by 13th Gen Intel® Core™ i3 processor, the ThinkSmart Tiny Kit is a collaboration maestro with a compact compute, ample memory, storage, and connectivity ports. Easily control and share content with the ThinkSmart Controller, an intuitive 10.1-inch, 10-point touch antiglare and smudgeless display.

Remote Management of In-room Devices

Remote Management of In-room Devices

Offering real-time insights into device utilization, the ThinkSmart Manager Basic, an integral part of the ThinkSmart Tiny Kit, helps you determine the utilization of rooms to make better technology investments. What's more, take the lead with remote management and monitoring of distinct in-room devices to revolutionize your workspace.

Making Collaborations Inclusive & Easy

Making Collaborations Inclusive & Easy

Transform meetings with the ThinkSmart Tiny Kit — where inclusivity meets innovation. Our certified and rigorously tested devices scale up your meeting spaces effortlessly. Upgrade small meeting spaces that have been under-utilized with modern video conferencing technology.

Performance & Security at Every Front

Performance & Security at Every Front

Unlock unparalleled privacy and security from the start with the ThinkSmart Tiny Kit. Experience consistent, robust performance to satisfy your requirements with Windows 11 preload merging Office 365 ecosystem. Moreover, its advanced management and reporting tools maximize the potential of all your meeting spaces, right out of the box.

Device Support All the Way Through

Device Support All the Way Through

Besides enjoying a comprehensive collaboration space equipped with high-quality audio, video, and native Microsoft apps, you benefit from a year of onsite warranty and Lenovo Premier Support — watch out for your ThinkSmart Tiny Kit from both software and hardware perspective with quick assistance from our IT experts.

Step into Microsoft Teams Rooms for Richer Collaboration
- Compact compute purposely refreshed & certified by Microsoft Teams Rooms
- 13th Gen Intel® Core™ i3 processor & Windows 11 for cohesive experience
- Free up your laptops for a productive & streamlined meeting experience
- ThinkSmart Controller with impeccable display to control & share content
Processor
Processor generationIntel Core i3-13xxx
Processor cache typeSmart Cache
Processor cache12 MB
Processor modeli3-13100T
Processor manufacturerIntel
Processor boost frequency4.2 GHz
Processor threads8
Processor cores4
Processor familyIntel® Core™ i3
Performance cores4
Efficient cores0
Performance-core base frequency2.5 GHz
Processor base power35 W
Maximum turbo power69 W
Performance-core Max Turbo Frequency4.2 GHz
Memory
Memory layout (slots x size)2 x 8 GB
Internal memory16 GB
Maximum internal memory16 GB
Memory slots2x SO-DIMM
Internal memory typeDDR4-SDRAM
Memory clock speed3200 MHz
Memory channelsDual-channel
Storage
Storage mediaSSD
Number of storage drives installed1
Optical drive typeNo
SSD interfacePCI Express 4.0
SSD capacity256 GB
Number of SSDs installed1
Total storage capacity256 GB
SSD form factorM.2
Total SSDs capacity256 GB
NVMeYes
Graphics
Discrete graphics cardNo
On-board graphics card familyIntel® UHD Graphics
On-board graphics cardYes
Discrete graphics card modelNot available
On-board graphics card modelIntel UHD Graphics 730
On-board GPU manufacturerIntel
Optical drive
Optical drive typeNo
Network
Ethernet LANYes
Wi-FiYes
BluetoothYes
Bluetooth version5.3
Wi-Fi standardsWi-Fi 6E (802.11ax)
Ethernet LAN data rates100,1000 Mbit/s
Cabling technology10/100/1000Base-T(X)
WLAN controller modelIntel Wi-Fi 6E AX211
Top Wi-Fi standardWi-Fi 6E (802.11ax)
Antenna type2x2
WLAN controller manufacturerIntel
Ports & interfaces
Combo headphone/mic portYes
USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity1
USB 3.2 Gen 1 (3.1 Gen 1) Type-C ports quantity1
USB 3.2 Gen 2 (3.1 Gen 2) Type-A ports quantity4
USB 3.2 Gen 2 (3.1 Gen 2) Type-C ports quantity0
Thunderbolt 3 ports quantity0
HDMI version2.1
USB 2.0 ports quantity0
HDMI ports quantity1
Ethernet LAN (RJ-45) ports1
Technical details
Cable lock slot typeKensington
Product typeMini PC
Trusted Platform Module (TPM)Yes
Product colourBlack
Chassis typeMini PC
Audio systemHigh Definition Audio
Cable lock slotYes
Motherboard chipsetIntel Q670
Box contentsHDMI Ingest Dongle
Design
VESA mountingYes
Cable lock slot typeKensington
Product colourBlack
Chassis typeMini PC
Cable lock slotYes
Colour nameBlack
Performance
Audio chipRealtek ALC256-VB
Password protectionYes
Password protection typeBIOS, HDD, Power on, Supervisor
Product typeMini PC
Trusted Platform Module (TPM)Yes
Audio systemHigh Definition Audio
Motherboard chipsetIntel Q670
Trusted Platform Module (TPM) version2.0
Software
Operating system languageEnglish
Operating system architecture64-bit
Operating system installedWindows 11 IoT Enterprise
Power
Power supply input frequency50/60 Hz
Power supply input voltage100 - 240 V
Power supply90 W
Operational conditions
Operating altitude0 - 3048 m
Storage temperature (T-T)-40 - 60 °C
Operating relative humidity (H-H)20 - 80%
Storage relative humidity (H-H)10 - 90%
Operating temperature (T-T)5 - 35 °C
Non-operating altitude0 - 12192 m
Ergonomics
VESA mountingYes
Weight & dimensions
Package width313 mm
Package depth242 mm
Package height327 mm
Width179 mm
Depth182.9 mm
Height36.5 mm
Package weight4.9 kg
Weight2.65 kg
Packaging data
Package width313 mm
Package depth242 mm
Package height327 mm
Package weight4.9 kg
Packaging content
Display resolution1280 x 800 pixels
Display diagonal25.6 cm (10.1")
Display brightness340 cd/m²
Display includedYes
Native aspect ratio16:10
Display
Display resolution1280 x 800 pixels
Display diagonal25.6 cm (10.1")
Display brightness340 cd/m²
Display includedYes
Native aspect ratio16:10
Other features
VESA mountingYes
Trusted Platform Module (TPM)Yes
On-board graphics cardYes
Processor manufacturerIntel