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Supermicro AMD EPYC 7313P processor 3 GHz 128 MB L3 Box
SKU
PSE-MLN7313P-0339
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Available for backorder
AMD EPYC 7313P 3.0GHz, 16C/32T, 128M Cache (155W) DDR4-3200
Category: Processors
| Processor socket | Socket SP3 |
|---|---|
| Box | Yes |
| Processor cores | 16 |
| Processor family | AMD EPYC |
| SKU | PSE-MLN7313P-0339 |
| EAN | 0672042446537 |
| Manufacturer | Supermicro |
| Availability | Out of Stock |
The AMD EPYC 7313P 3.0GHz 16 Core Processor enhances the performance and the speed of your system. Additionally, the Virtualization Technology enables migration of more environments. It supports enhanced SpeedStep® technology that allows tradeoffs to be made between performance and power consumption.
Its Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. The VT-x with Extended Page Tables (EPT) also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Packed with more features, the AMD EPYC 7313P 3.0GHz 16 Core Processor is the ideal choice for virtually all of your data demanding or standard enterprise infrastructure applications.
Its Thermal Monitoring Technologies protect the processor package and the system from thermal failure through several thermal management features. The VT-x with Extended Page Tables (EPT) also known as Second Level Address Translation (SLAT), provides acceleration for memory intensive virtualized applications. Packed with more features, the AMD EPYC 7313P 3.0GHz 16 Core Processor is the ideal choice for virtually all of your data demanding or standard enterprise infrastructure applications.
| Processor | |
|---|---|
| Processor base frequency | 3 GHz |
| Processor manufacturer | AMD |
| Configurable TDP-down | 155 W |
| Thermal Design Power (TDP) | 155 W |
| Processor cache | 128 MB |
| Processor model | 7313P |
| Processor threads | 32 |
| Processor boost frequency | 3.7 GHz |
| Processor family | AMD EPYC |
| Processor cores | 16 |
| Processor socket | Socket SP3 |
| Configurable TDP-up | 180 W |
| Processor cache type | L3 |
| Package type | Box |
| Memory | |
| Memory types supported by processor | DDR4-SDRAM |
| Memory clock speeds supported by processor | 3200 MHz |
| Memory channels | Octa-channel |
| Memory bandwidth (max) | 204.8 GB/s |
| Graphics | |
| Discrete graphics card | No |
| On-board graphics card model | Not available |
| On-board graphics card | No |
| Discrete graphics card model | Not available |
| Power | |
| Configurable TDP-down | 155 W |
| Thermal Design Power (TDP) | 155 W |
| Technical details | |
|---|---|
| PCI Express slots version | 4.0 |
| Thermal Design Power (TDP) | 155 W |
| Market segment | Server |
| Configurable TDP-up | 180 W |
| Processor cache type | L3 |
| Features | |
| Maximum number of PCI Express lanes | 128 |
| Thermal Design Power (TDP) | 155 W |
| PCI Express slots version | 4.0 |
| Market segment | Server |
| Processor special features | |
| Configurable TDP-up | 180 W |
| Packaging data | |
| Package type | Box |